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SMT Solder Paste Mixer Automatic Solder Paste Stirring Machine

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Guangdong Okai Intelligent Technology Co., Ltd.

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SMT Solder Paste Mixer Automatic Solder Paste Stirring Machine

Name: SMT Solder Paste Mixer Automatic Solder Paste Stirring Machine
Brand: Okai Intelligent Technology Co., Ltd.
Price: 1 USD

SMT Solder Paste Mixer Automatic Solder Paste Stirring Machine Manufactures

Payment Terms : T/T

Test Functions : Viscosity Slump Tack Solder Ball

Display : LCD digital with data export

Temperature Range : Ambient to 250 degree C

Model Number : OK-XGJBJ

Power Supply : AC 110V/220V 50/60Hz

Condition : New

MOQ : 1 Set

Delivery Time : 3-7 working days

Sample Size : Standard 500g jar compatible

Origin : China

Price : open to negotiation

Test Standards : IPC-TM-650 JIS Z 3284

Certification : ISO 9001

Feature : Uniform Mixing Performance

Supply Ability : 500 Sets per Month

Machine Model : OK-QC500

Packaging Details : Standard export carton with foam insert, calibrated test fixtures included, double-wall corrugated packaging

Product Name : SMT Solder Paste Mixer

Brand Name : Okai Intelligent Technology Co., Ltd.

Dimensions : 350×300×200mm

Equipment Type : SMT Auxiliary Equipment

Application : SMT PCB Printing Process

Place of Origin : Guangdong, China

Core Function : Solder Paste Stirring & Mixing

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OK-QC500 Solder Paste Aging Inspection Tester

The OK-QC500 is a dedicated solder paste quality control tester for verifying that aged and rewarmed solder paste meets printing specifications before entering production. It performs the four critical IPC-TM-650 standard tests — viscosity, slump, tack, and solder ball — providing lab-grade quality assurance in a compact benchtop instrument.

Key Features

Viscosity Test: Measures paste viscosity after rewarming against manufacturer specifications to verify proper flow characteristics for stencil printing
Slump Test: Evaluates paste shape retention after printing — cold or over-aged paste that spreads laterally will be detected before causing bridging defects
Tack Test: Quantifies paste tackiness to ensure adequate component hold force during placement and transport before reflow
Solder Ball Test: Identifies paste degradation by checking for excessive solder ball formation during reflow — a key indicator of expired or improperly stored paste
IPC-TM-650 and JIS Z 3284 Compliant: Test protocols aligned with international industry standards for auditable quality records

Applications

Essential for SMT quality labs, incoming inspection departments, and production lines running fine-pitch assembly where paste quality directly impacts first-pass yield. Recommended for facilities using refrigerated paste storage and FIFO inventory management.

Packaging and Shipping

Compact benchtop instrument with standard export packaging. Includes calibrated test fixtures and protocol documentation. Delivery in 3-7 working days.

Attributes

Attributes	Attribute value
Product Name	SMT Solder Paste Mixer
Core Function	Solder Paste Stirring & Mixing
Feature	Uniform Mixing Performance
Equipment Type	SMT Auxiliary Equipment
Application	SMT PCB Printing Process
Condition	New
Origin	China

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